12.02.2025
Wire bonding continues to be one of the most important connection technologies in electronics. To accommodate ever smaller more densely packaged components and new wire materials while meeting the need to become ever more efficient, including networking and monitoring every step, new solutions are needed.
ASMPT SEMI Solutions is excited to unveil our newest wire bonder, designed to elevate your semiconductor manufacturing process!
Key Features:
Learn more about our wire bonder and how it can enhance your production capabilities.
5