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Introducing the Enhanced AERO PRO XPOWER 2.0!

24.04.2025

We're thrilled to unveil the latest features of the AERO PRO XPOWER 2.0 – a cutting-edge leader in semiconductor wire bonding!

What’s New in XPOWER 2.0?

Optimized Bonding Precision
  • Our upgraded hardware and software deliver unparalleled accuracy and productivity for all wire bonding applications.
Smart Process Automation
  • Experience seamless automation that adapts to your production needs, improving efficiency and output.

Elevate your manufacturing capabilities with the power of AERO PRO XPOWER 2.0!

Discover more about the latest features XPOWER 2.0 and how it can elevate your production processes.

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