ASMPT Semiconductor Solutions
Back
Back
  • Products
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back

MEGA

High Flexibility & High Precision Multi-chip Die Bonder

Features

  • Patented look-through pattern recognition technology
  • High precision bonding*
    • XY placement: ± 2 µm @ 3σ
    • Die rotation: ± 0.1° @ 3σ
  • Large substrate handling, max 280 mm x 300 mm substrate size
  • 12” wafer input handling
  • Advanced BLT control
  • Multi-chip bonding capability
    • Auto bond-tool change, up to 10 bond-tool buffers and 5 ejectors tools
    • High flexibility options to fulfill the requirements of diverse multi-chip packages

Brochure

* All performance is package and material dependent

Corporate Information
Products
Solutions
Social Media
© ASMPT 2024 | Legal notice

Choose your preferred language

English | Deutsch | 日本語 | 简体中文 | 繁體中文