Micro-Electro-Mechanical Systems (MEMs) and sensors are key enablers in the new era of IoT, Artificial Intelligence, robotics, and smart technology. There is sustainable growth in this market and many new and interesting applications. The package design, assembly flow and process requirements are highly customized. With a full vertical assembly equipment portfolio, ASMPT is in the best position to provide customer turnkey solution, meeting today’s time-to-market business model.
New Generation of 12” Automatic Die Bonder
Automatic Flip Chip Bonder
Automatic Die Bonding System (8” Wafer Handling)
A New Dimension of Wire Bonding (for High-end IC Applications)
Transfer Molding System Meeting All Package Demand
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