Visit our Center of Competence (CoC) in Hong Kong, Singapore or Regensberg and experience an open global network for all questions relating to semiconductor packaging and solutions for automotive packaging.
Describe to us your individual challenges or packaging requirements that you want to solve on existing or future products. Our process experts will provide you with suitable solutions and help your team to put them into practice.
Contact your personal ASMPT account manager to set up an appointment.
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