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ALSI LASER1206

Are you looking for the perfect platform for developing new process solutions for Advanced Packaging or Power Automotive applications? ASMPT ALSI’s LASER1206 platform includes advanced laser technology that brings you to the next step of your chip manufacturing process.

The Platform

The LASER1206 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.

The ergonomic design, the user-friendly touch screen display and the ease-of-use allow the operator to control the system easily for a wide variety of products. As the LASER1206 systems meet the industrial standards in accordance with CE regulations, no special precautions nor training are required to safely operate the systems.

Multi-beam Technology

The multi-beam technology of ASMPT ALSI uses a Matrix-DOE to provide a fully optimized process and superior customer value for:

  • Achieving low Heat Affected Zone (HAZ)
  • Achieving low or Zero burr
  • Creating a smooth bottom and steep sidewalls

To discover all about the UV-USP technology, view the video.

Features & Benefits

  • Multi-beam Advanced Laser Technology included: limited local heat load offers the best possible process quality & high die strength.
  • Dicing & Grooving capability for High volume manufacturing.
  • Fully automated film frame and bare wafer handling capability.
  • Including wafer coating & cleaning and wafer coating drying station.
  • Clean mini-environment (Class 1000) Guarantee: closed doors between every process module.

Applications

The LASER1206 supports multiple semiconductor processes and materials:

  • UV-Dicing Plus

    • Materials: Low-K, PI, Si, SiC, GaN, GaAs, TEG, BSM, Mold, DAF, NCF
    • Wafer Thickness: 20–200 µm
    • Processes: V-DOE dicing, trenching, deep scribe

  • UV-USP-Grooving

    • Materials: Low-K, PI, TEG
    • Wafer Thickness: 60–800 µm
    • Processes: Trenching, grooving, deep scribe
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