ASMPT Semiconductor Solutions
Back
Back
  • Products
  • IC & Discrete
  • Advanced Packaging
  • CMOS Image Sensor In-line Solution
  • LED / Photonics
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back

Deposition Solutions | ECD Wafer

Wafer Plating - Stratus™ P300

ECD 300 – 200 mm Wafer Processing

Applications

  • Configurable for up to 6 metals
  • UBM/RDL
  • Fan Out
  • RF Filters
  • Power Devices

Features

  • Dual wafer size capability
  • Membrane Cells for long bath stability
  • ShearPlate™ technology for thinnest boundary layer
  • Substrate handling flexibility

Substrates

  • 300 and 200 mm wafers
  • Silicon, eWLB, Bonded, Carrier

Other Products

Brochure & Video

Enquiry

Related Topics

Asm Advancedpackaging Solutions 960x540px

Advanced Packaging

Complete portfolio for wafer level and panel level packaging technologies.

Learn more about our portfolio
Corporate Information
Products
Solutions
Social Media
© ASMPT 2024 | Legal notice

Choose your preferred language

English | Deutsch | 日本語 | 简体中文 | 繁體中文