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ECD | Panel Plating - Stratus™ P500

The Stratus™ P500 has been proven to deliver wafer scale plating precision on panels up to 510 x 515 mm at the leading panel makers. This panel scale plating tool is a semiconductor industry game changer because it brings higher quality, wafer level chemistries to glass and epoxy panel substrates. More information

Applications
  • Configurable for up to 5 metals
  • Multi-chip Fan Out
  • SoC packages
  • MicroLED
Substrates
  • 510×515 mm panels, custom
  • Glass, Composite, Other
Features
  • Wafer level precision hardware and software
  • Cu, Sn(Ag), Ni & Au plating @<10µm L/S
  • Single/Dual sided plating
  • Membrane cells provide high chemistry utilization
  • Multi-zone anodes for optimized uniformity with thick and thin seeds
  • Patterned shields for uniform high throughput plating

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