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AD838L-Plus

Automatic Die Bonder

Features

  • AD838L Series exclusive material handling capability, dragging-free indexing
  • Advanced bond head design, patented technology, achieving high UPH
  • Extra-large substrate material handling, up to 300 mm x 100 mm
  • High precision bonding option
    • Achieving ±15 μm @ 3σ XY placement accuracy*
    • Patented technology, without any UPH trade-off for high precision bonding
  • Achieving factory automation
    • Automatic material handling system
    • Automatic wafer loader (option)

Brochure

* All performance is package and material dependent

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