ASMPT Semiconductor Solutions
Back
Back
  • Products
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back

AD211Plus-II

Heated Collet Eutectic Die Bonder

Features

  • Excellent void control
    • Patented heated collet technology
    • H2 forming gas handling
    • Auto tip-tilt alignment (Option)
  • High precision eutectic bonding
    • XY placement: ± 7 µm @ 3σ*
    • Die rotation: ± 1° @ 3σ* (Die size > 0.5 mm)
  • Enhancing package reliability with High yield
    • Optional smart heating system, anti-baking thermal management
    • Accurate health check on heated collet temperature (Option)

Brochure

* All performance is package and material dependent

Corporate Information
Products
Solutions
Social Media
© ASMPT 2024 | Legal notice

Choose your preferred language

English | Deutsch | 日本語 | 简体中文 | 繁體中文