ASMPT invites you to join us at SEMICON Japan 2025 held from 17 - 19 December at the Tokyo Big Sight, Japan. ASMPT will be exhibiting at booth # TBA with our experts on hand to answer questions and discuss your packaging needs.
Date: 17 - 19 December 2025 Location: Tokyo Big Sight, Japan Booth: TBA
About SEMICON Japan SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMICON Japan 2025 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging and Chiplet Summit (APCS) will be held concurrently, bringing together top players in the semiconductor packaging and PCB mounting fields.
Event Details
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