18.07.2024
ASMPT MEGA series of fully automatic multi-chip bonding machines feature high-precision bonding technology accurate to ±1.5μm and patented dynamic alignment technology. MEGA series supports various components such as photodiodes PD, vertical cavity surface emitting lasers VCSEL, transimpedance amplifiers TIA, electronic integrated circuits EIC, and chip-on-chip COC. The flexible machine configuration enables handling complex multi-chip packaging requirements in a single machine.
The artificial intelligence (AI) market is experiencing unprecedented growth, demanding high-speed data exchanges and powerful computing capabilities for massive data training and inference. Optical transceivers play a crucial role in enabling fast data transmission and processing within server clusters. As the cornerstone of AI computing development, optical communication offers high speed, wide bandwidth, enhanced security, and minimal signal loss, significantly improving information transmission rates and capacities.
While current optical transceiver technology has reached a milestone of 800G, the surge in AI advancements has sparked a strong demand for 1.6T optical transceivers. According to CICC's research report, large-scale batch deployment of 1.6T optical transceivers is expected in 2025, with estimated shipments ranging from 3.6 million to 5.95 million units.
Optoelectronic chips play a critical role in optical transceivers, directly influencing their transmission rates and capacities. To achieve a transmission rate of 1.6T, optoelectronic chips must possess the following capabilities to support the continuous upgrading and evolution of optical communication systems:
1. High-speed processing: Optoelectronic chips need higher modulation bandwidth and faster response speeds to handle substantial data flows.
2. Low-power design: While maintaining high performance, optoelectronic chips should minimize power consumption to reduce overall energy usage.
3. Excellent signal quality: To ensure stable and reliable signals during high-speed transmission, optical transceivers must provide outstanding signal quality, including low noise, low distortion, and high linearity.
4. Compatibility and extensibility: Optical transceivers should possess excellent compatibility and extensibility to adapt to different applications and future technology upgrades, laying a solid foundation for widespread adoption.
Amidst the industry's eagerness to produce optoelectronic wafers, challenges in design, material selection, and process know-how hinder the production process.
The accuracy of bonding directly impacts the performance and reliability of optical transceivers. Precise placement and alignment of optoelectronic chips and components are crucial for achieving low noise and low distortion.
ASMPT MEGA series of fully automatic multi-chip bonding machines feature high-precision bonding technology accurate to ±1.5μm and patented dynamic alignment technology.
Furthermore, the MEGA series supports various components such as photodiodes (PD), vertical cavity surface emitting lasers (VCSEL), transimpedance amplifiers (TIA), electronic integrated circuits (EIC), and chip-on-chip (COC). The flexible machine configuration enables handling complex multi-chip packaging requirements in a single machine.
Currently, the MEGA series has earned certification from leading Tier-1 optical transceiver manufacturers and is deployed in high-precision optical transceiver mass production lines.
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