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LITHOBOLT® G2

In the ever-evolving semiconductor industry, the need for cutting-edge manufacturing solutions has become paramount. Enter LITHOBOLT® G2 - an engineering marvel that is poised to redefine the landscape of advanced assembly and packaging.

Features

  • Ultra-high precision control and ASMPT's commitment to innovation
  • Direct and collective Die to Wafer (D2W) Hybrid Bonding Process
  • Deliver superior interconnect quality and productivity
  • Flexible design supports both standalone and cascade configurations for enhanced operational efficiency

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