ASMPT Semiconductor Solutions
Back
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics
Back
Back
Back

Eagle AERO

One of our most popular products, the Eagle AERO is the pioneer product to be imbued with the now patented X-Power, thermosonic bonding technology in the wire bonding process, supported by the Aeroducer transducer that supports a dual frequency of X and Y direction. Built with great management software like AeroEye for smarter monitoring and quality assurance.

Features

  • Up to 30% higher in UPH
    • for a typical Cu wire application
  • 22μm bonded ball size
    • Expertly engineered to reduce ball size to 22μm with 0.5mil wire
  • Application ready up to 30μm
  • Other configurations catering to the market
    • iHawk AERO: for low pin count discrete applications

Brochure

Choose your preferred language

English | Deutsch | 日本語 | 简体中文 | 繁體中文