ASMPT has been in the optoelectronic industry for more than 40 years. From 7-segment to today's Micro LED, we are familiar with the process and technology of the industry, and are committed to breaking through technology, solving technical problems, and promoting product popularization and commercialization. For example, the zero-void eutectic die bonding technology has improved heat dissipation and reliability for high-power LEDs; an innovative bondhead is developed for Mini LEDs, which makes the pass-through rate of COB Mini LED displays nearly 100%, and accelerates the introduction of Mini LED displays into the market; comprehensive Micro LED solutions, stamp transfer and mass bond technology, already in HVM level, leading the industry; catering to the demand of optical communication technology, a high-precision & high-flexibility multi-chip die-bonding system has been launched to enhance Optical module transmission speed and stability. We target the Micro LED and optical communication markets, work with optoelectronic customers to develop new technologies and accelerate the commercialization process.
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Automatic Die Bonding
High Precision Die Bonding
Mass Transfer
High Performance LED Die Bonding
Thermosonic Wire Bonding
Ultrasonic Wedge Bonder
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