Photon Pro, an Automatic High Precision Die Bonder with patented look-through pattern recognition technology for superior bonding accuracy. It handles large substrates up to 200 mm x 215 mm and enhances material traceability with OCR. The Photon Pro features multi-chip bonding capability, auto bond-tool change with 10 buffers, and auto wafer change with a 2-stage ejector system. With its high flexibility options, this bonder meets the diverse needs of multi-chip packages, making it the ultimate solution for precision bonding in the semiconductor industry.
Applications: Wide applications on various optical transceivers & sensor packages (TOSA, ROSA, Mechanical Optical Interface (MOI), 3D sensor, inertial sensor, etc)
Brochure
* All performance is package and material dependent
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