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Wire Bonding

AeroLED

Automatic Wire Bonder

Dimensions W x D x H
1,200 mm x 900 mm x 1,760 mm

Features

  • High speed wire bonding: 24 wires/sec for 2mm*
  • 35 µm bonded ball size
  • Dual directional transducer
  • XY-table of stable state
  • Precision control wire clamp gap
  • All material FAB controlled box
  • Nano driver soution

*Designs, colors and specifications are subject to change without prior notice | All performance is package and materials depandent

Enquiry

AB589 Series

Automatic Wire Bonder

Dimensions W x D x H
1,170 mm x 800 mm x 2,020 mm

Features

  • Rotary Bond Head Platform
  • High speed wire bonding: 6.5 wires/sec*
  • Fine pitch capability: 55 µm x 65 µm
  • Innovative PR technology: PR On The Fly
    • Shorten alignment time
  • Latest rotary bond head design enhancing stability and reliability
  • Extra large effective bonding area: 8” x 6”
  • Supporting various workholder design for full range application
  • Saving human resources
    • Capable to handle raw PCB, vertical integrating the production material capability of the entire production line
    • Saving time of manual load/unload, simplify the bonding, testing and packaging processes
  • AB589-H Automatic material handling capability (option)
  • Gold wire wedge bonding capability (option)
  • Deep access bonding capability
    • 45° bonding angle (option)

*Designs, colors and specifications are subject to change without prior notice | All performance is package and materials depandent

Enquiry

AB550

Automatic Wire Bonder

Dimensions W x D x H
1,020 mm x 850 mm x 1,350 mm

Features

  • High speed wire bonding: 9 wires/sec*
  • Fine pitch handling capability
    • Smallest bond pad size: 63 µm x 80 µm*
    • Finest pad pitch: 68 µm*
  • Innovative PR technology: PR On The Fly
    • Saving up to 48% PR time
    • Especially fit for high density substrate, e.g. RFID, multi-die on multi-PCB
  • Extra large effective bonding area, up to Ø 100 mm
  • More precise & reduced error of rotation (EOR) due to optimized DDR motor
    • Despite enlarged the workchuck, increased the radius of rotation, bonding accuracy has been greatly enhanced
  • Enhanced multi-PCB handling capability comparing to AB530
    • Effective bonding area: ↑ 75%
    • Higher bonding capacity
    • Reducing load/unload frequency, saving labor costs
      • Average labor time for load/unload per PCB: ↓ 56%

*Designs, colors and specifications are subject to change without prior notice | All performance is package and materials depandent

Enquiry

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