ASMPT Semiconductor Solutions
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics


Automotive assistance systems require radar, lidar and opto-electronic sensors that must be robust, reliable and precise. One example of this technology are cameras with lenses that must be aligned perfectly over the sensor dies during their production.

One innovative solution for this process is the ASMPT AUTOPIA. With its Active Alignment feature, it reads the image signal of the CMOS sensor and compares it with reference image values while it positions the lens. A placement solution like the SIPLACE CA (Chip Assembly) can combine sensors & bare dies with SMT components to form compact SiPs (systems-in-package).


High Speed and Large Panel Die/SMD Bonding

  • Accuracy: ± 10 µm @ 3σ (local alignment)
  • Up to 685x650mm substrate handling
  • Combining Wafer, Tape&Reel and Trays in a single platform

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Wafer Plating - Stratus™ P300

ECD 300 – 200 mm Wafer Processing

  • Dual wafer size capability
  • Membrane Cells for long bath stability
  • ShearPlate™ technology for thinnest boundary layer
  • Substrate handling flexibility

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ALSI Laser1205

Mold Dicing

  • Narrow dicing width using multi beam (20 µm depending on filler size)
  • Ability to dice multi layer stacks (mold, Si, back Metal, Low-K)
  • Alignment capability for molded wafers (M-WLCSP)
  • Kerf check on the fly

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DEK Galaxy

Solder Ball Attachment

  • Highest print accuracy platform 2.0Cpk repeatability @ ± 12.5μm
  • High accuracy applications at wafer, substrate and board level
  • Fastest Printing platform at 7 sec


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