Advanced packaging technologies are extremely complex and demand manufacturing methods with exceptional precision in all process steps. Close control and optimization of all parameters ensure that quality and yield rates can be brought up to the required levels even in high-volume environments. The only way to accomplish this is with manufacturing equipment that‘s equally precise and efficient.
With highly specialized subsidiaries NEXX, ALSI and AMICRA, ASMPT offers complete solutions in the areas of electrification, sensor technology and fast data transfer.
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Stepping into the new era of the Metaverse trend, immersive human-computer interaction is the vital cornerstones of the metaverse, particularly rely on a high resolution and high performance VR/AR devices. ASMPT plays a global leading role in providing packaging equipment for VR/AR semiconductor components and further developing new technologies for more comprehensive solutions for display, power management ICs, MCUs, RF communication, MEMS and sensors, memories, and cameras to lead the digitalized future.
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