As the world’s largest supplier of semiconductor equipment, we offer a wide range of die bonding and flip chip solutions that perfectly support your prototype, small-lot or high-volume production while meeting all your requirements in terms of precision, speed, panel size and flexibility.
New Generation of 12” Automatic Die Bonder
Automatic Die Bonding System (12” wafer handling)
Automatic Flip Chip Bonder
Automatic Die Bonding System (8” wafer handling)
Automatic Eutectic Die Bonding System
Automatic Soft Solder Die Bonding System
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