As the world’s largest supplier of semiconductor equipment, we offer a wide range of die bonding, multi-chip and flip chip solutions that perfectly support your prototype, small-lot or high-volume production while meeting all your requirements in terms of precision, speed, panel size and flexibility.
Automatic High Precision Die Bonder
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Automatic Eutectic Die Bonder with Heated Collet Bond Head
Multichip Die Bonder
Automatic Die Bonder