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Die Bonding

As the world’s largest supplier of semiconductor equipment, we offer a wide range of die bonding, multi-chip and flip chip solutions that perfectly support your prototype, small-lot or high-volume production while meeting all your requirements in terms of precision, speed, panel size and flexibility.

Photon Pro

Automatic High Precision Die Bonder

Dimensions W x D x H
2,280 mm x 1,735 mm x 1,780 mm

Features

  • Patented look-through pattern recognition technology
  • High precision bonding
    • XY placement ± 3 µm @ 3σ
    • Die rotation ± 0.1° @ 3σ
  • Large substrate handling, max 200 mm x 215 mm substrate size
  • Enhance material traceability by using Optical Character Recognition (OCR)
  • Multi-chip bonding capability
    • Auto bond-tool change, up to 10 bond-tool buffers
    • Auto wafer change, up to 6 x 6” OD Foton Ring with 2-stage ejector system
    • High flexibility options to fulfill the requirements of diverse multi-chip packages

Optional features

  • Auto Switching from Dispensing to Stamping
  • Up to 5 Ejector Tools
  • Cascade with Tape Feeder Handler
  • Level Sensor for BLT Control
  • Insitu Bonding with UV Curing
  • Waffle Pack / Gel-pak Input

Enquiry

AD280Plus

Automatic High Precision Die Bonder

Dimensions W x D x H
2,150 mm x 1,400 mm x 2,300 mm

Features

  • Achieving ± 3 µm @ 3σ XY placement with patented look-through pattern recognition
  • Flip chip handling capability
  • Diverse material handling
    • Standard: Wafer on expander or clamp ring
    • Optional: Waffle pack, Gelpak, tray, tape feeder or by request
  • Enhancing traceability by barcode, 2D code or Optical Character Recognition (OCR) on substrate / wafer / die (option)
  • Optional features to enhance bonding accuracy
    • Precise bond force control with bond force sensor
    • Snap UV curing to enhance high precision bonding performance
      • Support both spot curing & panel curing (Substrate size dependent)
      • Eg. Lens attach for PCB / COB transceiver packages

AD211Plus-II

Automatic Eutectic Die Bonder with Heated Collet Bond Head

Dimensions W x D x H
2,160 mm x 1,430 mm x 2,080 mm

Features

  • Excellent Void Control
    • Patented heated collet technology
    • H2 forming gas handling
    • Auto tip-tilt alignment (option)
  • High Precision Eutectic Bonding
    • XY placement: ± 7 µm @ 3σ
    • Die rotation: ± 1° @ 3σ (Die size > 0.5 mm)
  • Enhancing Package Reliability with High Yield
    • Optional smart heating system, anti-baking thermal management
    • Accurate health check on heated collet temperature (option)

Enquiry

uWave

Multichip Die Bonder

Dimensions W x D x H
1,930 mm x 1,440 mm x 2,080 mm

Features

  • High precision bonding
    • XY placement: ± 10 μm @ 3σ
    • Die rotation: ± 0.5° @ 3σ
  • High flexibility of multi-die handling
    • Wide range of die size handling
    • Auto changing 7 collets
    • Auto ejector changer with 5 ejectors (option)
    • Support various inputs, e.g. wafer, waffle pack, GelPak, tape feeder, bowl feeder, etc
  • Diverse bonding capabilities
    • Enable various die bonding rotations or Z-levels
    • PR on die back
    • PR on die top (option)
    • Flip chip (option)

Enquiry

AD838L-G2

Automatic Die Bonder

Dimensions W x D x H
1,930 mm x 1,440 mm x 2,080 mm

Features

  • High precision bonding performance with high throughput
  • Flip chip handling capability
  • AD838L Series exclusive material handling capability, dragging-free indexing
  • Extra large substrate handling, up to 300 mm x 100 mm
  • PR On The Fly capability of up-look PR enhancing placement accuracy & bonding cycle time
  • Achieving factory automation
    • Automatic material handling system
    • Automatic wafer loader (option)

Enquiry

AD838L-Plus

Automatic Die Bonder

Dimensions W x D x H
1,930 mm x 1,440 mm x 2,080 mm

Features

  • AD838L Series exclusive material handling capability, dragging–free indexing
  • Advanced bond head design, patented technology, achieving high UPH
  • Extra large substrate handling, up to 300 mm x 100 mm
  • High precision bonding option
    • Achieving ±15 μm @ 3σ XY placement accuracy
    • Patented technology, without any UPH trade-off for high precision bonding
  • Achieving factory automation
    • Automatic material handling system
    • Automatic wafer loader (option)

Enquiry

AD830Plus

Automatic Die Bonder

Dimensions W x D x H
1,740 mm x 1,240 mm x 2,080 mm

Features

  • High Throughput
    • High speed bonding: up to 22,000* UPH
    • Implementing patented design
      • Double decoupled linear motor bond head system
    • Enhanced dual stamping / dot dispensing speed by latest actuating control system
    • Further improving bonding speed with rotary collet bond arm system
      • Providing automatic theta collection during pick & place process
  • Fast conversion time
    • New stamping arm design
    • Magnetic anvil block design
  • Lastest ASMPT Developed PR System
    • Static bond optic system without motor used
    • Simpler operation and easy maintenance
    • Reducing time for a bonding cycle
      • Taking pre-bond and post-bond inspection at the same time
  • In-line capability (option)
    • Flexible to integrate with various types of ovens and collecting systems
    • Achieving factory automation with in-line capability
    • Supporting multi-die handling with cascade capability

Enquiry

AD800

Automatic Die Bonder

Dimensions W x D x H
1,570 mm x 1,160 mm x 2,075 mm

Features

  • Ultra high speed: 50 ms cycle time
  • Excellent bonding performance
    • XY placement: ± 25 µm @ 3σ
    • Die rotation: ± 3° @ 3σ
  • Small die handling capability: down to 76.2 µm
  • Large substrate handling capability: up to 270 mm x 100 mm
  • Full quality inspections: defect inspection, pre-bond & post-bond
    • Auto skip unit & die, which are inked or poor quality
    • Pre-bond inspection: stamping quality
    • Post-bond inspection: bonding performance
  • Saving costs of ownership & production
    • Saving maintenance costs by linear motors
    • Energy saving, low power consumption
    • High UPH / footprint ratio, enhancing use of factory space

Enquiry

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