AD280Plus, an Automatic High Precision Die Bonder that achieves ± 3 µm @ 3σ XY placement accuracy with patented pattern recognition. It offers flip chip handling and diverse material compatibility, including wafer, waffle pack, Gel-Pak, tray, tape feeder, or custom options. Enhancing traceability, it incorporates barcode, 2D code, or OCR technology on substrates, wafers, and dies. AD280Plus sets a new standard for precision, versatility, and traceability in die bonding technology.
Brochure
* All performance is package and material dependent
5