Best of class Process Quality

• Process for HP Grooving UV USP wavelength 343 µm; pulse length 0.5 .. 10 ps
• Production example burr < 1 µm
• Process depth (w/wo metal) < 1 µm
• Die strength > 800 MP
• Process control In-line vision and process parameter logging

Production Scalability

• Full automated calibration D-DOE set < 1 µm
• Flexibility up to 8 DOE’s recipe selectable
• Proven platform concept for last 10 years

Compliant with Production Chain

• Wafer handling capable of handling wafer thickness down to 80 µm grooved wafers

Competitive CoO

• Production speed UPH same or better than Grooving UV processes

Best of class Process Quality

• Dedicated to HP Grooving UV wavelength 355 µm; pulse length ns range
• Combined with Multi-Beam concept resulting in nice U-shape grooving profiles
• Process control in-line vision and process parameter logging

Production Scalability

• Full automated calibrations accurate trenching and matrix DOE set < 1 µm; power level < 0.1 W; logging;
• Flexibility up to 8 DOE’s (recipe selectable)

Compliant with Production Chain

• Wafer handling option to convert accurately between 8" and 12“ frames
• Cassette load station manual, Automated Material Handling System (AMHS)
• Factory control SECS/GEM interface

Competitive CoO

• UPH Gain due to indexing > 20%
• UPH Gain due to Kerf Check “On-the-Fly” > 25%

Best of class Process Quality

• Dedicated to HP UV Dicing wavelength 355 µm; pulse length 0.5 .. 10 ps
• Combined with Multi beam concept resulting in low HAZ values (< 3 µm)
• Process control in-line vision and process parameter logging

Production Scalability

• Full automated calibrations accurate trenching, line, matrix and V-DOE set < 1 µm; power level < 0.1 W
• Flexibility up to 8 DOE’s (recipe selectable)

Compliant with Production Chain

• Wafer handling option to convert accurately between 8" and 12“ frames
• Cassette load station manual, Automated Material Handling System (AMHS)
• Factory control SECS/GEM interface

Competitive CoO

• High speed Full cut process
• One production step for multi layered wafers (DAF tape; Backside metals; Topside structures)
• Low consumption of coating

Best of class Process Quality

• High power IR Dicing wavelength 1064 µm; pulse length ns range
• Work horse for GaAs dicing up to 300 µm thickness
• Die strength enhancement by the patented wet etch post process is very effective to enhance side wall quality and burr removal

Production Scalability

• Full recipe control for coating, dicing and cleaning
• Flexibility up to 3 DOE’s (recipe selectable)

Compliant with Production Chain

• Wafer handling options to convert accurately between 8" and 12“ frames
• Cassette load station manual, Automated Material Handling System (AMHS)
• Factory control SECS/GEM interface