Die Bonder and Flip Chip Bonder
ASMPT AMICRA's highly accurate die bonder / flip chip bonder system (±1.0 µm), with multi-chip capability, a modular machine concept and much more!
ASMPT AMICRA’s ultra-precision die bonder / flip chip bonder which supports ±0.2 µm @ 3σ placement accuracy, offering the highest placement accuracy in its class!
High-precision Chip-on-Substrate Bonding
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5 µm), a cycle time of <15 sec. as well as a modular machine concept, a flip chip option and much more.
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