ASMPT Smart COB Inline is a comprehensive chip-on-board (COB) inline solution specifically designed for packaging CMOS image sensors. It offers intelligent inline capabilities that are highly suitable for a wide range of applications, including smartphone cameras, AR/VR devices, security cameras, 3D sensing, medical cameras, and automotive cameras.
This advanced inline solution combines exceptional precision and bonding performance, delivering optimal optical results while maintaining cost-effectiveness and maximizing productivity. With a fully modular design, it offers flexibility and scalability to meet diverse production needs. The solution prioritizes cleanliness by integrating HEPA/ULPA filters and cleaning modules, ensuring a highly clean bonding environment that meets the highest standards.
ASMPT takes immense pride in being one of the pioneering companies that offer comprehensive, one-stop manufacturing solutions for CMOS image sensor packaging. By incorporating Smart Factory and Industry 4.0 technologies, ASMPT has propelled CIS manufacturing to new heights. With a remarkable market presence and widespread customer recognition, ASMPT stands at the forefront of the CMOS image sensor packaging industry. Contact Us to Learn More
CMOS Image Sensor CMATLine (Automotive Camera Assembly)
12" Automatic Die Bonder
Automatic Lens Holder Bonder
Automated Optical Inspection (AOI) Machine
Automatic DI-water Cleaning System
Automatic Plasma Cleaning System
Snap Cure Oven
Input & Output Buffer System
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