The HERCULES is the new generation automatic heavy aluminum wire bonding system that allows high-speed bonding for wide range of power packages and module applications. Leveraging on ‘iCut’ an ASMPT developed advanced cutting process to ensure utmost wire cutting accuracy.
With 4 – 20mil Al wire handling capability, and a large, effective bonding area of 110 x 130mm and a multi-row substrate handling capabilities. The HERCULES is also widely applicable for power packages and modules applications (TO Series, DPAK matrix, Power Modules).
Brochure
Heavy Aluminum Wire Bonding System (for Module-based Applications)
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