AD800

Features

• Ultra high speed: 50 ms cycle time
• Excellent bonding performance
  • XY placement: ± 25 µm @ 3σ*
  • Die rotation: ± 3° @ 3σ*
• Small die handling capability: down to 76.2 µm
• Large substrate handling capability: up to 270 mm x 100 mm
• Full quality inspections: defect inspection, pre-bond & post-bond
  • Auto skip unit & die, which are inked or poor quality
  • Pre-bond inspection: stamping quality
  • Post-bond inspection: bonding performance
• Saving costs of ownership & production
  • Saving maintenance costs by linear motors
  • Energy saving, low power consumption
  • High UPH / footprint ratio, enhancing use of factory space

Brochure

* All performance is package and material dependent