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AB550

Automatic Wire Bonder

Features

  • High speed wire bonding: 9 wires/sec*
  • Fine pitch handling capability
    • Smallest bond pad size: 63 µm x 80 µm
    • Finest pad pitch: 68 µm
  • Innovative PR technology: PR On The Fly
    • Shorten alignment time
    • Especially fit for high density substrate, e.g. RFID, multi-die on multi-PCB
  • Extra large effective bonding area, up to Ø 100 mm
  • More precise & reduced error of rotation (EOR) due to optimized DDR motor
    • Despite enlarged the workchuck, increased the radius of rotation, bonding accuracy has been greatly enhanced
  • Enhanced multi-PCB handling capability comparing to AB530
    • Effective bonding area: ↑ 75%
    • Higher bonding capacity
    • Reducing load/unload frequency, saving labor costs
      • Average labor time for load/unload per PCB: ↓ 56%

Brochure

* All performance is package and material dependent

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