AB550

Features

• High speed wire bonding: 9 wires/sec*
• Fine pitch handling capability
  • Smallest bond pad size: 63 µm x 80 µm
  • Finest pad pitch: 68 µm
• Innovative PR technology: PR On The Fly
  • Shorten alignment time
  • Especially fit for high density substrate, e.g. RFID, multi-die on multi-PCB
• Extra large effective bonding area, up to Ø 100 mm
• More precise & reduced error of rotation (EOR) due to optimized DDR motor
  • Despite enlarged the workchuck, increased the radius of rotation, bonding accuracy has been greatly enhanced
• Enhanced multi-PCB handling capability comparing to AB530
  • Effective bonding area: ↑ 75%
  • Higher bonding capacity
  • Reducing load/unload frequency, saving labor costs
    • Average labor time for load/unload per PCB: ↓ 56%

Brochure

* All performance is package and material dependent