VORTEX II - High Performance LED Die Bonder, our state-of-the-art machine designed for Mini LED applications. Capable of handling 2 mil x 4 mil Mini LED components and applicable to RGB ultra fine pitch direct view LED displays, this advanced system delivers high-speed performance, exceptional yield, and precision. With its novel bondhead featuring Zero-Delay XYθ auto-alignment capability and seamless integration for automation with the InLine Linker.
Applications: Mini LED RGB fine pitch / ultra fine pitch direct view display, as fine as P0.4
Brochure
* All performance is package and material dependent
5