CoS is a new development of ASMPT AMICRA especially designed to conquer all Chip on Submount applications. This machine is capable to perform multi-die bonding of up to ±1.5 µm @3σ placement accuracy on singulated submounts by using eutectic bonding method, realized either with a ceramic pulse heater or localized non-contact laser heating with a cycle time up to 6s.
Beside this bonding methods the CoS can also be equipped with epoxy stamping suitable for solder paste or epoxy.
The core is the bonding table equipped with two bonding chucks. While from the chip side the machine uses ASMPT AMICRA dynamic alignment method to pick chips and bond with high precision to a submount, the submount side loads new submount and unloads finished CoS, in parallel it can perform stamping or preform handling.
For questions regarding the COS Die Bonder please contact our worldwide support team.
* All performance is package and material dependent
Die Bonder and Flip Chip Bonder
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5 µm), a cycle time of <15 sec. as well as a modular machine concept, a flip chip option and much more.
ASMPT AMICRA's highly accurate die bonder / flip chip bonder system (±1.0 µm), with multi-chip capability, a modular machine concept and much more!
ASMPT AMICRA’s ultra-precision die bonder / flip chip bonder which supports ± 0.2 µm @ 3σ placement accuracy, offering the highest placement accuracy in its class!
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