ASMPT AMICRA‘s die bonding technology was specifically designed to serve the photonic assembly market by providing the ultimate placement accuracy while supporting a high speed AuSn eutectic bonding process. ASMPT AMICRA has been perfecting this technology for more than 20 years, developing high resolution imaging systems to support the dynamic alignment system, implementing a fiber laser to be used as the primary heat source for AuSn eutectic bonding, high resolution motion control systems mounted on a granite structure with a special vibration damping system. The principle design of this vision driven die bonder is to mount all 4x imaging systems in fixed positions, mounted to granite, while all other motion control systems move around the vision cameras. This fundamental design concept produces the highest precision placement accuracy die bonder in the industry today.
For questions regarding the NANO Die Bonder please contact our worldwide support team.
* All performance is package and material dependent
High-precision Chip-on-Substrate Bonding
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5 µm), a cycle time of <15 sec. as well as a modular machine concept, a flip chip option and much more.
Die Bonder and Flip Chip Bonder
ASMPT AMICRA's highly accurate die bonder / flip chip bonder system (±1.0 µm), with multi-chip capability, a modular machine concept and much more!
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