AD830 Plus

Automatic Die Bonder

Dimensions	W x D x H
	1,740 mm x 1,240 mm x 2,080 mm

Feature

• High Throughput
  • High speed bonding: up to 22,000 UPH
  • Implementing patented design
    • Double decoupled linear motor bond head system
  • Enhanced dual stamping / dot dispensing speed by latest actuating control system
  • Further improving bonding speed with rotary collet bond arm system
    • Providing automatic theta collection during pick & place process
• Providing automatic theta collection during pick & place process
  • New stamping arm design
  • Magnetic anvil block design
• Lastest ASMPT Developed PR System
  • Static bond optic system without motor used
  • Simpler operation and easy maintenance
  • Reducing time for a bonding cycle
    • Taking pre-bond and post-bond inspection at the same time
• In-line capability (Option)
  • Flexible to integrate with various types of ovens and collecting systems
  • Achieving factory automation with in-line capability
  • Supporting multi-die handling with cascade capability

Enquiry