ASMPT Semiconductor Solutions
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics

ASMPT at AutoSens USA, Detroit, May 21-23, 2024, Booth 262. CMAT-S: high-speed lens assembly and alignment in one


The CMAT-S system represents the latest generation of camera and sensor alignment applications by ASMPT. With the company’s patented Continuous Sweep Alignment process, it achieves impressive alignment speeds of ten seconds or less per camera. By utilizing the continuous movement of the target object during the imaging process, CMAT-S enhances alignment precision and speed of the alignment, resulting in uniform focus across the entire field of view. This innovative approach not only supports the latest sensor requirements but also ensures superior camera quality. The system's precise and efficient assembly capabilities enable exceptional throughput without compromising camera performance.

“We're happy to announce our sponsorship at AutoSens USA and to unveil our cutting-edge active alignment and test solutions at this esteemed event," remarked Jean-Marc Peallat, General Manager at ASMPT AEI. "Our CMAT-S lens and sensor alignment systems demonstrate our dedication to delivering streamlined, top-notch solutions for the growing demand in large-scale automotive camera manufacturing. We look forward to diving into the technology, explaining its ins and outs and giving you the chance to see the future of camera manufacturing and test firsthand.”

About ASMPT Limited (“ASMPT”)

ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT’s offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition to the various solutions that organise, assemble, and package delicate electronic components into a vast range of end-user devices, which include electronics, mobile communications, computing, automotive, industrial and LED (displays). ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality.

ASMPT is listed on the Stock Exchange of Hong Kong (HKEX stock code: 0522), and is one of the constituent stocks of the Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under the Hang Seng Composite Industry Indexes, the Hang Seng Corporate Sustainability Benchmark Index, and the Hang Seng HK 35 Index.

To learn more about ASMPT, please visit us at

About ASMPT Semiconductor Solutions (“ASMPT SEMI”)

ASMPT SEMI is the leading supplier in advanced packaging and semiconductor assembly solutions. With a commitment to innovation and customer satisfaction, ASMPT SEMI provides a comprehensive range of products and services that cater to the evolving needs of the microelectronics industry. Their expertise spans across areas such as flip-chip and wafer-level packaging, advanced interconnect technologies, and more. ASMPT SEMI's cutting-edge solutions enable customers to achieve higher performance, increased reliability, and improved cost-efficiency when producing their semiconductor devices.

For more information about ASMPT SEMI, visit

Media contacts:

Global ASMPT Semiconductor Solutions Press Office
ASMPT Hong Kong
Jessica Ho
Semiconductor Solutions

Global ASMPT Press Office
Susanne Oswald
Rupert-Mayer-Strasse 48 81379 Munich
Germany Tel: +49 89 20800-26439

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