Photon Pro

Automatic High Precision Die Bonder

Dimensions	W x D x H
	2,280 mm x 1,735 mm x 1,780 mm

Feature

• Patented look-through pattern recognition technology
• High precision bonding
  • XY placement: ± 3 µm @ 3σ
  • Die rotation: ± 0.1° @ 3σ
• Large substrate handling, max 200 mm x 215 mm substrate size
• Enhance material traceability by using OCR
• Multi-chip bonding capability
  • Auto bond-tool change, up to 10 bond-tool buffers
  • Auto wafer change, up to 6 x 6” OD Foton Ring with 2-stage ejector system
  • High flexibility options to fulfill the requirements of diverse multi-chip packages

Optional features

• Auto Switching from Dispensing to Stamping
• Up to 5 Ejector Tools
• Cascade with Tape Feeder Handler
• Level Sensor for BLT Control
• Insitu Bonding with UV Curing
• Waffle Pack / Gel-pak Input

Enquiry